Si Wafer Hemispherical Wells

This is where the description of your sample piece go.  No need to be a full paragraph, just consice details and/or motivation for piece.

Machining Data:

Machine: Sodick AG35L EDM
Work material: 4″ Si wafer w/ Au coating
Dielectric: Oil, Royal Flush
Electrode material: PCD
Electrode undersize: 0.05 mm
Machining depth: 0.425 mm
Surface roughness: 15 um, Rz (before HNA etch finishing)
Total cycle time: 56 min (200 features)