Si Wafer Hemispherical Wells

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Machining Data:

Machine: Sodick AG35L EDM
Work material: 4" Si wafer w/ Au coating
Dielectric: Oil, Royal Flush
Electrode material: PCD
Electrode undersize: 0.05 mm
Machining depth: 0.425 mm
Surface roughness: 15 um, Rz (before HNA etch finishing)
Total cycle time: 56 min (200 features)
Presentation